This note describes a simplified thermal model of the ADC boards, to determine whether there are bottlenecks in the heat transfer.


With the current design, the TI ADC chips are running close to their maximum operating temperature, without a lot of margin. This indicates that better cooling is required. However, no detailed thermal analysis of the board design has been carried out, to determine if there are improvements that could be made that would provide an adequate margin even if we rely entirely on passive cooling.


Thermal analysis and results: ADC_board_thermal_analysis.pdf